Options
Automation
Inline A connection with a coater and developer is possible.
Inline link with coater/developer
To realize fully automated process lines for coating, exposure, and developing, inline connections between lithography tools and coater/developers are required. USHIO has experience with this type of configuration.
FOUP
Most OHT transfer systems require FOUPs, and the UX-4 is capable of handling them.
Mask Auto changer
15-30 masks can be stored in the mask library. A handy barcode reader can be equipped with this option in order to verify mask ID (barcode/QR code/Data Matrix).
SECS/GEM Online
The tool can be controlled from a host computer. This online system can be customized upon request.
AGV
Some process lines use AGVs (Automatic Guided Vehicles). USHIO can design tools for such systems.
High Productivity
Tact up option
Throughput improvement option/High speed option
The standard throughtput is 120 WPH. For some square substrates, it is possible to improve it to 160 WPH.
Inline tact up option
Throughput improvement option/High speed option for inline link
In the case of an inline system, we plan to further improve throughput.(Under development: 180 WPH)
LED light source
By changing the light source from a lamp to an LED, the total running cost can be reduced. Also, it is very eco friendly and sustainable to change a light souce to LED. (Under development）
Proximity mask possible
Mirror projection type alginer's mask possible
Mirror projection type alginer is an old scanner-type aligner. Masks for MPA can be used with USHIO's projection mask aligner.
The masks of other mask aligners from Europe and Japan are possible.
The masks from some other companies in Europe and Japan can be used with the UX-4.
High precision alignment
Several ways of Alignment Topside and backside alignment
Both topside and backside alignment are possible. In addition, IR alignment can be added if required.
Various software for searching Pattern matching, Edge searching, Rectangular searching, Integral search
Pattern matching is the basic alignment software. However, we sometimes recommend other software and illumination options based on the visibility/detectability of the customer's alignment marks.
Wafer handling know-how
Magnification option
The magnification is up to±100ppm. This option addresses some issues in case a wafer expands due to certain causes.
Solutions for warpage
"Multi-step vacuuming" enables warped wafers to be vacuumed smoothly. We have special solutions for the wafer arm chuck end effector as well.
Bernoulli for very thin wafers
"Bernoulli end effector" floats wafers without contact by using air. For some very thin wafers.
Various types of wafers in the same tool
Not only Si, but also compound semiconductors such as SiC and GaN can be processed.
Wafers with some experiences
Si, III-V Compond wafers (GaAs, GaN, GaP, InP), SiC, Glass, Sapphire, LN, LT, Thin wafers, Thick wafers, TAIKO wafers, TSVs, TGVs