Orders Now Open for the New Product “UX-45114SC” of the UX-4 Series, Full Field Projection Aligner for Wafers

Improved resolution and overlay accuracy while maintaining the same exposure field size

Ushio Inc. (Head office: Tokyo, President and CEO: Takabumi Asahi; hereinafter “Ushio”) hereby announces that it will begin accepting orders for the new product “UX-45114SC” of the UX-4 series, full field projection aligner for wafers, starting from Q1 2026. The UX-45114SC achieves a resolution of L/S = 2.8μm and improved overlay accuracy while remaining compatible with φ6/φ8 inch wafers. The UX-45114SC is the latest model in the UX-4 series, which has a proven track record over many years as lithography equipment that enhances production efficiency, primarily for power semiconductors, MEMS sensors, and devices related to the communications and photoelectronic fusion (optical semiconductors.) In recent years, miniaturization has progressed in response to demands for higher performance in these devices. Furthermore, efforts to increase wafer sizes have advanced, with φ6/φ8 inch diameters becoming more common to improve chip productivity. To meet these needs, Ushio has adopted a specialized optical microscope based on the unique optical design technology it has cultivated since its founding. This has led to the successful development of the UX-45114SC, which is compatible with φ6/φ8 inch wafers, boasts a resolution of L/S = 2.8μm, and offers improved overlay accuracy. This enables improved resolution and overlay accuracy while maintaining high throughput for the larger wafers and higher-precision layers of next-generation electronic devices, which are essential for the evolution of IoT, 5G, and mobility, thereby achieving productivity and higher yields equal to or better than conventional methods. As a leading company in full field projection aligners for wafers, Ushio will continue to contribute to the realization of a convenient and comfortable society through light. This product will be exhibited on a panel at SEMICON Japan 2025 (Booth No. E4522), which will be held at Tokyo Big Sight from December 17th to 19th.

■Main Features - Full field projection exposure: No mask damage, high productivity 120WPH - Deep depth of focus: exposure to 3D surface shapes, Thick film resist exposure - Automation compatible: Inline, Online, OHT/AGV compatible - Resolution L/S = 2.8μm - Improved overlay accuracy - Mercury-free, Compatible with LED light sources

*Appearance and specifications are subject to change without prior notice. ※1 By selecting a filter, the combination of resolution and DOF can be selected from "resolution 2.8 μm, DOF ±10 μm" or "resolution 3 μm, DOF ±20 μm."