The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components, and microelectronic systems science, technology, and education in an environment of collaboration and technical exchange.
【Exhibit Summary】
・Open period : May 26 (Tue) to May 29 (Fri), 2026.
・Venue : JW Marriot & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
・Booth No : 1105
・Entrance fee: Charged (pre-registration required)
・Official Website: The 2026 IEEE 76th Electronic Components and Technology Conference
【Exhibit Details】
■Excimer Technologies
Featuring the world’s highest irradiance and maximum exposure for enhanced productivity.
Ushio’s 172 nm excimer technology enables high-efficiency organic cleaning and surface modification using high-energy vacuum UV light (VUV).
This process improves surface properties without damaging or roughening the substrate, making it ideal for sensitive materials.
It enhances adhesion and improves performance in processes such as coating and bonding, supporting consistent, high-throughput manufacturing across a wide range of applications.
Learn more about 172 nm Excimer UV technology
■Large-Area Projection Exposure System; UX-4, UX-5 series
・Non-contact and large shot-size, capable of high productivity.
・The UX-4 can expose up to 8-inch wafers non-contact, one shot per wafer. It enables exposure on warped wafers using a wide focus depth, achieving high productivity and yield different from proximity aligners.
・The UX-5 is designed as a stepper for advanced packaging substrates, capable of exposing full-size (510x515mm) substrates in 4 shots.
■Ushio Presentations at ECTC 2026
Oral Presentation
Schedule: Friday, May 29 at 9:50 AM
Title: First Demonstration of Stitching-Free Exposure Over an Ultra-Large 18-Reticle Area with High-Resolution 1.5 µm Line/Space on Glass Substrates
Authors: Naoya Sohara, Toshimitsu Arai, Ryotaro Takahashi, Naoki Gotou, Hirosuke Takamatsu
Poster Presentation (Interactive Session)
・ Title: An Evaluation of Hybrid Bonding of Cu/SiO2 Using Vacuum Ultraviolet Light Under Redox Gases
Authors: Shinichi Endo, Kejun Wu, Kengo Nishio, Akihiro Shimizu
Session 39: Interactive Presentations – Bonding Processes and Analysis in Next Generation Interconnects
Poster No. 28
・ Title: Room-Temperature Reduction of Molybdenum Oxide via 172-nm Vacuum Ultraviolet Irradiation in an H2/N2 Atmosphere with H2O Vapo
Authors: Akihiro Shimizu, Shinichi Endo
Session 40: Interactive Presentations – Materials, Manufacturing, and Assembly Techniques in Advanced Packaging Solutions
Poster No. 21