The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components, and microelectronic systems science, technology, and education in an environment of collaboration and technical exchange.
【Exhibit Summary】
・Open period May 27(Tue.) to May 30(Fri.), 2025.
・Venue Gaylord Texan Resort&Convention Center Dallas, TX, USA
・Booth No 122
・Entrance fee Charged (pre-registration required)
・Official Website: ECTC | IEEE Electronic Components and Technology Conference
【Exhibit Details】
Excimer Technologies
・The world’s highest irradiance and maximum exposure for high productivity.
・Organic cleaning and surface reformulation are performed using vacuum ultraviolet light and radicals generated by itself.Surface reformulation can be performed without roughening the substrate surface, which contributes to improved adhesion of various materials.
Large-Area Projection Exposure System; UX-4, UX-5 series
・Non-contact and large shot-size, capable of high productivity.
・The UX-4 can expose up to 8-inch wafers non-contact, one shot per wafer. It enables exposure on warped wafers using a wide focus depth, achieving high productivity and yield different from proximity aligners.
・The UX-5 is designed as a stepper for advanced packaging substrates, capable of exposing full-size (510x515mm) substrates in 4 shots.
Digital Lithography Technology from Applied Materials and Ushio 「DLT」
・The new DLT system is the only lithography technology that can achieve the resolution necessary for advanced substrate applications while delivering throughput levels required for high-volume production.
・With the ability to pattern less than 2-micron line widths, the system enables the highest area density for chiplet architectures on any substrate, including wafers or large panels made of glass or organic materials.
・Applied pioneered the technology behind the DLT system and will be responsible for R&D and definition of a scalable roadmap together with Ushio to enable continued innovation in advanced packaging to 1-micron line widths and beyond.