Annoucement for Semicon West 2025 in Phoenix, AZ, USA

We will exhibit our booth at "SEMICON West 2025" Phoenix Convention Center in Phoenix, Arizona from October 7th to October 9th, 2025.

There will be our Excimer Technologies, Lithography Technologies (Panel-level Stepper, Full-field Projection Aligner and Interference Lithography Tool), and Radiant Heat Sources (Flash lamp annealing equipment, LED annealing equipment and halogen lamps) so please visit our booth! We are looking forward to seeing you there!

▼SEMICON West 2025 Official URL

SEMICON West 2025

Ushio Booth

Open period	October 7(Tue.) to October 9(Thu.), 2025.
Venue	Phoenix Convention Center in Phoenix, Arizona USA
Booth No.	1435
Official URL	https://www.semiconwest.org/

Exhibit Details

Excimer Irradiation Unit

The world's highest irradiance and maximum exposure for unparalleled productivity!

Organic cleaning and surface reformulation are performed using vacuum ultraviolet light and radicals generated by itself.

Surface reformulation can be performed without roughening the substrate surface, which contributes to improved adhesion of various materials.

Large-Area Projection Lithography System; UX-4, UX-5 series

Non-contact and large shot-size, capable of high productivity.

The lithography tools utilize Ushio's robust lighting and optical technologies, along with unique large-area projection lens technology.

・The UX-4 is capable of processing up to 8-inch wafers with non-contact and one shot per wafer. Enabling exposure on warped wafers using a greater depth of focus, which achieves higher productivity and better yield than proximity aligners.

・The UX-5 is designed as a stepper projection lithography tool for advanced packaging substrates, which is capable of exposing full-size (510x515mm) substrates. On August 5, 2025, Ushio announced the development outlook of the UX-59113 on top of our existing product line, a stepper for advanced packaging that achieves a resolution of L/S=1.5µm and exposure field of 100mm squared or more per shot. Please visit our booth and get in touch with our staff for more details.

【Key Technologies】

• Equipped with the world's leading high-pressure UV lamp

• Unique illumination optical system boasting high uniformity

• Outstanding large-area projection lens

• Large depth of focus for stable patterning

• Large shot enables high productivity

Interference lithography system

Supporting pitch compensation optical system & phase-shift diffraction grating

We have succeeded in the development of a new interference exposure system that achieves a pitch accuracy of 0.01nm and enables the formation of phase shift structures. This product is scheduled to be launched in the spring of 2027. The applications are expected to include semiconductor lasers such as DFB-LD and VCSEL, as well as AR/VR devices.

【Key Technologies】

1.Excellent stability and enables uniform exposure over large substrates by using a 266 nm DPSS laser, and KrF photoresist.

2.Pitch Compensation Optical System by combining direct measurement technology for interference fringes and nanometer-order stage control technology

3.Phase Shift Diffraction Gratings by combining DOE

Flash Lamp Annealer

Ultra-short time annealing with high-power, wide-area irradiation, and precise control over the depth of heating in the target material.

This is an annealing (light heating and light sintering) device using a flashlamp. It can instantaneously heat large areas (up to 500×500mm) with high output. Compared to conventional electric furnaces and halogen lamp heating furnaces, it boasts high-precision temperature control along the depth direction of the workpiece.

The emitted spectrum ranges from ultraviolet to infrared, allowing for heating of various materials with absorption characteristics in that range.

In particular, if you are facing difficulties in temperature control during the heating process, it may be the optimal solution for you.