Applications

UX-4 user application

MEMS / Crystal oscillators / SAW filters / RF devices / Sensors / Inkjet heads / Diodes / IGBT / Power semiconductors / Thyristors / MOS-FETs / LEDs / Power amps / MMICs / BAW filters / Acceleration sensors / Inductors / Passive components / Solar cells and more

Power Device

  • - USHIO has experience with IGBT, Si/SiC MOS-FET, Si/SiC Diodes, and Thyristors.
  • - This full projection mask aligner, UX-4, is especially suitable for polyimide layers which require high exposure energy .
  • - We have experiences with compound wafers such as SiC with high warpage. In addition to warped SiC wafers, thick GaN wafers, 4/6 or 6/8 inch Si wafers, and Taiko wafers can be handled in the same machine. This advantage is also preferable for foundries.

Sensor MEMS

  • - USHIO has experience with inertial sensors, accelerometers, gyroscopes, pressure sensors, and magnetic sensors.
  • - The large DOF (Depth of Focus) and focus offset option are effective for the 3D structures that MEMS sensors have.
  • - IR and backside alignment methods are also possible for some bonded wafers and SOI wafers.

RF devices

  • - USHIO has experiences with SAW filters, amplifier filters,- condensers, etc.
  • - We have experiences with compound wafers such as SiC, III-V Compond wafers (GaN, GaN on Si, InP, GaAs) and LT(Lithium Tantalate)/LN(Lithium Niobate). All of these wafers can be processed using the same tool.
  • - Most of layers can be exposed by this full-field projection mask aligner.